Cleaner after Lapping

Cleaner after Lapping

Overview

  • Full automatic cleaning process with
    ultrasonic cleaning, rinsing.
  • Possible to clean variety size(2inch ~ 6inch)
  • Cleaning for residues and surface contamination

Specification

Material Sapphire Wafer(Semi Auto and Full Auto Cleaner)
Wafer Size 2/4/6 inch
Wafer Thickness 43㎛
Cleaning Bath Alkali Detergent with Ultrasonic
Rinsing Bath Rinse with Ultrasonic
Cassette 25pcs/cassette X 4pcs =100pcs (Based on 6 inch)
Circulation Circulation and Filtering
Capacity Over 300pcs / Hr , Efficiency : Over 95%
Auto Transfer In conveyor → Cleaning & Rinsing → Auto transfer → Out conveyor
Dry Hot Air Blower (Special design for low wafer breakage)
O/P 10 inch Touch Screen
Safety Over/level/limit sensor and interlock