Final Cleaning M/C

Final Cleaning M/C

Overview

  • This system is designed to clean
    silicon safers with basket loaded.
  • The process includes ultrasonic cleaning,
    rinsing and dry with hot air.
  • Full automatic cleaning process
    with capacity of over 6000pcs/hour.

Specification

Material Si (Multi & Mono)
Wafer Size 156X156mm (Other size on application)
Wafer Thickness 160 micro (Other size on application)
Cleaning Bath Detergent with Ultrasonic
Rinsing Bath Rinse with Ultrasonic (High Frequency)
Cassette 50pcs/cassette X 4pcs =200pcs
Circulation Circulation and Filtering
Capacity Over 2400pcs / Hr
Auto Dosing Auto dosing station (Optional)
Dry Hot Air Blower (Special design for low wafer breakage)
O/P 10 inch Touch Screen
Safety Over/level/limit sensor and interlock